Award-winning embedded electronics consultancy, ByteSnap Design, has revealed the impact of COVID-19 and top strategies to survive adopted by UK companies during the pandemic in its new electronics industry survey report: Thriving in the Face of Change.
Farnell’s third annual Internet of Things (IoT) Survey also confirms rise in IoT for medical applications, due to the COVID-19 pandemic.
Communications T&M provider, Anritsu has announced that it has successfully verified a number of key 3GPP Release 16 features using its Radio Communication Test Station MT8000A, in combination with Samsung Electronics’ System LSI Business latest 5G Exynos Modem.
This month’s issue, now available in print or digital editions, contains features on Electromechanical (including connectors & enclosures) technologies and Military & Aerospace applications, plus the latest edition of EPDT's twice-yearly Electronics Distribution supplement.
Included in this month’s EPDT July issue, the latest edition of this year's twice-yearly Electronics Distribution supplements, covering the world of electronic components distribution, is now available in print or digital editions.
A layman’s guide to cryogenics & superconductivity – and how to make the right connections…
Community members are invited to use Infineon Technology to build a low-power IoT (Internet of Things) device that enhances industrial design.
Research highlights how technology companies can improve the end-user experience for consumer electronics, automotive and healthcare in an increasingly hyperconnected world.
Combining multiple technologies to drive optimal performance, GaN performance in NXP’s multi-chip modules for 5G infrastructure increases efficiency by 8 percentage points, as well as reducing size & weight of radios and accelerating design & deployment of 5G systems.