Electronic Product Design & Test

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Industry’s first space-qualified, radiation-tolerant COTS-based Ethernet transceiver & embedded microcontroller

Anritsu's Wireless Connectivity Test Set now supports IEEE 802.11ax (Wi-Fi 6)

The future is orange: new biocompatible plastics adhesive which fluoresces orange from Techsil

Timestrip goes electronic, launching supply chain temperature breach indicators

AV 4.0 initiative announced by US Transportation Secretary in keynote at CES 2020

EtherCAT interface option added to programmable DC power supply series

- Siemens partners with Arm to redefine design capabilities for complex electronic systems & accelerate the future of mobility (08/01/2020)
  
  The partnership brings together leading-edge integrated circuit (IC) methodologies, processes & tools to help the automotive supply chain solve design & verification challenges. Leveraging Arm automotive IP & software within Siemens’ PAVE360 digital twin environment enables collaboration and empowers automakers & suppliers to develop & validate differentiated safety enabled systems, ICs & software solutions in the context of the entire vehicle.
- CES 2020 opens with innovation that will change the world (07/01/2020)
  
  CES 2020 opened Tuesday 7th January, unveiling the next generation of innovation that will redefine industries, create jobs & solve many of society’s challenges. With over 4,400 exhibiting companies, including 1,200 startups, CES 2020 features the latest transformative technologies, including 5G, AI, vehicle technology, digital health & more. Run by the Consumer Technology Association (CTA), #CES2020 runs through Friday January 10th in Las Vegas, Nevada.
- New LC3 codec for Bluetooth LE Audio now available for Cadence Tensilica HiFi DSPs (07/01/2020)
  
  Fresh from its announcement at #CES2020, HiFi customers can immediately benefit from the latest performance enhancements enabled by the new Bluetooth audio mode, including longer battery life, improved connectivity & multi-user sharing.
- Bluetooth LE Audio support speeds development of true wireless stereo (TWS) devices & audio sharing (07/01/2020)
  
  CEVA has announced general availability of RivieraWaves Bluetooth Low Energy & Dual Mode IPs, with support for game-changing LE Audio – uniquely positioning the company as a one-stop-shop for low power connectivity, audio/voice & sensor fusion for the wireless audio market.
- Next generation battery materials project exceeding expectations: Project SUNRISE update from Nexeon (06/01/2020)
  
  Nexeon, a UK company developing silicon materials for next generation Li-ion batteries, has reached the halfway stage in its £10million SUNRISE project, and has already produced silicon battery materials that have performed better than expected. Samples are now with potential customers for evaluation – and initial feedback has been very positive.
- Bluetooth SIG unveils LE Audio, the next generation of Bluetooth audio, at CES 2020 (06/01/2020)
  
  Announced at #CES2020, next-gen LE Audio will enhance Bluetooth audio performance, improve battery life & connectivity, add support for hearing aids & introduce Audio Sharing.
- STEM Matters: Guest column – Getting to the heart of technology (06/01/2020)
  
  Play is an important part of toddlers’ development and some of the most commonly used toys, like building blocks & puzzles, are based on the principle of assembly & disassembly, to help children acquire dexterity and understand cause & effect. The same idea can be applied to the study of technology.
- EPDT's H1 2020 IoT & Industry 4.0 supplement now available online (06/01/2020)
  
  Included in this month’s EPDT January issue, the first of this year's twice-yearly IoT & Industry 4.0 supplements is now available in print or digital editions.
- EPDT January 2020 issue (inc. Embedded & Mil/Aero features + IoT & Industry 4.0 supplement) now available online (06/01/2020)
  
  This month’s issue, now available in print or digital editions, contains features on Embedded technologies and Military & Aerospace applications, plus EPDT's twice-yearly IoT & Industry 4.0 supplement.

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