Electronic Product Design & Test - Features

Features - Test/Measurement

People counting algorithm from ADI ensures efficient space utilisation & worker safety

Big Bang Fair returns to Birmingham’s NEC in June 2022

New development tool for designers using low-power PolarFire RISC-V SoC FPGAs for embedded vision applications at the edge

Activist Engineering programme from RS urges DesignSpark community to 'engineer for a better world'

New i-BMS battery management system enables battery hot swapping to minimise charging time for low voltage EVs

World-first 5G vehicle OTA RF test system from Anritsu, MVG & Toyota

- 2021 Boards Guide for makers + companion AR app now available from Digi-Key & Make: (16/11/2021)
  
  Electronic components distributor, Digi-Key & Make:, a leading publication & network for makers, have released the 2021 Boards Guide & companion Digi-Key AR (augmented reality) app, available in both the Apple App Store for iOS devices & the Google Play store for Android-based mobile devices.
- New Lattice sensAI solution stack accelerates next-generation client computing devices (10/11/2021)
  
  Latest version of solution stack offers new features for power-efficient AI (artificial intelligence)/ML (machine learning) inferencing.
- UK’s first complete RADAR test service launched by TÜV SÜD (10/11/2021)
  
  Global product testing & certification organisation, TÜV SÜD has launched its dedicated Maritime SOLAS RADAR Test Range, the only independent test house in the UK – and one of three in the world – to offer ISO 17025* accredited testing against IEC 62388*.
- CSUG & Teledyne e2v unveil AI-enabled smart nanosatellite with on-board imaging processing at Space Tech Expo 2021 (10/11/2021)
  
  Grenoble University Space Centre (CSUG: Centre Spatial Universitaire de Grenoble), in partnership with scientific imaging & hi-rel semiconductor expert, Teledyne e2v, will use this year’s Space Tech Expo (from 16-18 November in Bremen, Germany) to provide visitors with a detailed demonstration of a high-performance image analysis system for CubeSat deployment.
- Industry-first imaging tech + AI for PCB AOI requires less qualification & improves high-precision inspection (10/11/2021)
  
  OMRON's next-generation 3D AOI PCB inspection system, the VT-S10 Series, uses innovative, multi-direction, multi-colour imaging, MPS (multi-phase shift) 3D hardware & advanced AI to reduce false calls, improve first-pass yields & optimise defect detection.
- Energy & Utility Skills becomes a Supporter of The Tomorrow’s Engineers Code (10/11/2021)
  
  The Code brings employers together to inspire a diverse engineering workforce. Energy & Utility Skills, EngineeringUK & SSE have released a video to promote the benefits of signing up to The Code to industry employers.
- NI offering SMEs greater access to testing technology via its Month of Deals (09/11/2021)
  
  NI’s Month of Deals to provide substantial discounts on selected test & measurement (T&M) products.
- NeoCortec signs agreement with Honeywell to develop wireless mesh technology for fire detection (08/11/2021)
  
  Manufacturer of ultra-low-power bi-directional wireless mesh network modules, NeoCortec recently signed an agreement with fire & life safety expert, Honeywell Building Technologies to develop wireless fire detection devices that offer higher reliability, ease of installation & commissioning, & competitive cost of ownership.
- UK schools to debate engineering solutions to climate change in #TEWeek21 'Schools COP' (08/11/2021)
  
  Tomorrow’s Engineers Week returns this week for its 9th year, running from 8-12 November 2021. Taking inspiration from COP26, #TEWeek21 will explore how engineers & engineering can contribute to tackling climate change & achieving net zero. As part of a Tomorrow’s Engineers Week Schools COP, classrooms across the UK will debate engineering solutions to climate change.

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