Electronic Product Design & Test

Features

People counting algorithm from ADI ensures efficient space utilisation & worker safety

Electrolube launches a global-first for conformal coatings

Big Bang Fair returns to Birmingham’s NEC in June 2022

Samsung to build $17B advanced semiconductor fab site in Taylor, Texas, USA

New development tool for designers using low-power PolarFire RISC-V SoC FPGAs for embedded vision applications at the edge

element14 hosts “Level-Up Your FPGA Skills: An Expert Panel Discussion”

- Activist Engineering programme from RS urges DesignSpark community to 'engineer for a better world' (22/11/2021)
  
  RS Components programme commences with a project calling on engineers to tackle indoor air pollution using new Raspberry Pi-based DesignSpark Environmental Sensor Development Platform.
- New i-BMS battery management system enables battery hot swapping to minimise charging time for low voltage EVs (18/11/2021)
  
  Sensata's new Lithium Balance i-BMS is a battery management system (BMS) for manufacturers of battery packs & low voltage electrified vehicle (EV) applications up to 60V, such as 2- & 3-wheelers, drones & robotics. It features ASIL C-rated key components, battery hot swapping functionality & advanced software that maximises battery use & increases vehicle range, uptime & performance.
- Eco-friendly recycled PET-G smart card inlays from Linxens certified as sustainable (18/11/2021)
  
  In a step towards a more responsible smart card industry, specialist manufacturer of secure electronic components for smart cards, Linxens has announced that its eco-friendly recycled PET-G inlays – the 'brain' of a smart card, integrating embedded electronics – have been certified as sustainable & included in the Mastercard Sustainable Materials Directory.
- World-first 5G vehicle OTA RF test system from Anritsu, MVG & Toyota (18/11/2021)
  
  Communications T&M provider, Anritsu has announced development of the world’s first 5G OTA RF test system in partnership with Toyota & its investment in MVG's OTA test environment, using Anritsu's Radio Communication Test Station MT8000A.
- TI to begin construction in 2022 on new 300-mm semiconductor wafer fabrication plants (17/11/2021)
  
  Investment in long-term manufacturing capacity further extends the company’s cost advantage & provides greater control of supply chain.
- Breakthrough on new material for making high performance components for use in next gen electronic devices (16/11/2021)
  
  New research from South Korea's Gwangju Institute of Science & Technology reveals the easy tunability of a perovskite material, opening doors to its widespread use in next generation electronics.
- 2021 Boards Guide for makers + companion AR app now available from Digi-Key & Make: (16/11/2021)
  
  Electronic components distributor, Digi-Key & Make:, a leading publication & network for makers, have released the 2021 Boards Guide & companion Digi-Key AR (augmented reality) app, available in both the Apple App Store for iOS devices & the Google Play store for Android-based mobile devices.
- New voice processors & reference design from British chip company target smart home devices (16/11/2021)
  
  Strengthening its position in voice interfaces for smart things, British smart IoT chip firm, XMOS has launched the XVF3610 voice processor for smart home devices & the XVF3615 – an Amazon wakeword-enabled variant of the new platform, as well as kick-starting an alpha programme for the ‘Avona’ voice reference design.
- New Lattice sensAI solution stack accelerates next-generation client computing devices (10/11/2021)
  
  Latest version of solution stack offers new features for power-efficient AI (artificial intelligence)/ML (machine learning) inferencing.

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