SMART Group company details from EPDT Magazine

Guide To Suppliers

SMART Group

94 Easton Street
High Wycombe
Bucks
HP11 1LT
United Kingdom

Telephone : 01494 465217
Web : www.smartgroup.org

Article archive for SMART Group;

- Industry 4.0 is on its way (05/01/2016)
  
  SMART Group's Industry 4.0 e-webinar on Tuesday 19th January will be presented by Phillip Stoten from Scoop Communications.
- Solder paste and joint automatic inspection experience (02/11/2015)
  
  Meet members of the SMART Group, NPL and their partners in the "Solder Paste and Solder Joint Automatic Inspection Experience", (A4, 506).
- Design and manufacture of high voltage- smart-e-webinar (07/07/2015)
  
  On the 14th July (14:30-16:00), these webinars will explore the current technical barriers faced in High Voltage electronics design and manufacturing processes.
- Smart e-webinar for electronic design and manufacturing (16/06/2015)
  
  With footprint becoming an ever increasing issue, demands on High Voltage electronics design and manufacture are becoming more difficult to manage.
- Raspberry Pi sets SMART Group European Conference theme (25/06/2013)
  
  The benefits of on-shoring is the conference theme setter for the SMART Group conference and exhibition in Thame, Oxford, in October.
- More reasons than ever to visit NEW:UK 2012 (16/04/2012)
  
  “Spend a couple of hours with the POP Team and you will have a significant advantage when specifying or implementing this technology in the future”
- Counterfeit component training CD-ROM (12/12/2011)
  
  SMART Group has announced the release of the first version of the 'ChipCheck Inspection of Counterfeit Components Guide'. This interactive guide provides an overview of the problem, corrective action and methods of test.
- Defining changes of RoHS (28/10/2011)
  
  A message from the SMART Group Technical Committee reveals that the European Commission (DG Environment) has launched a study on measures to be implemented and additional impact assessment with regard to scope changes, pursuant to the new RoHS Directive.
- What is the correct criteria for solder joint voiding? (23/09/2011)
  
  The answer will be provided by one of the key speakers at this year’s SMART Group Conference, taking place from 5-6 October 2011, when Dave Hillman of Rockwell Collins presents ‘BGA Voids: A Final Discussion on Inspection Standards, Voids Size and Reliability’.
- Solder wick or braid (03/08/2011)
  
  Desoldering is the removal of solder and components for troubleshooting, for repair purposes, component replacement, or to salvage components.
- Cleanliness testing (26/05/2011)
  
  Contaminometers, omegameter, and ionographs are all well-known commercial instruments used to measure ionic residues on the surface of electronic assemblies.
- Get SMART at area array reliability conference (20/05/2011)
  
  Following a successful two-day conference last year, The SMART Group has announced an exciting two-day conference for later this year.
- Thermocouple attachment (18/05/2011)
  
  When using thermocouple leads to measure temperature, the bead of the lead needs to be attached to the surface being monitored to assess any temperature change. The bead is the physical junction of the two dissimilar wires.
- Capillary action (17/03/2011)
  
  Capillary is an interaction between a liquid and a small diameter channel or opening in a solid object. Because of the physics involved, if the liquid can wet the sides of the solid channel or opening, surface tension will draw the liquid up into the capillary.
- Component compatibility to cleaning (17/02/2011)
  
  With many companies re-examining cleaning as a standard manufacturing process, component compatibility must be assessed at the design stage.
- Hot Air Knife (19/01/2011)
  
  There will always be designs that stretch a wave soldering system’s capability...
- SURVEY - What causes your most common solder paste printing defects? (07/01/2011)
  
  That’s the question currently being asked by The SMART Group.
- PCB Profiling (06/12/2010)
  
  Profiling and machining can be conducted during the manufacturing stages of printed circuit board production. It is most commonly associated with the final operations in the manufacturing cycle to define the board outline.
- Bottom Termination Component (05/11/2010)
  
  There are many components that fall into this category and are simply semiconductors that have termination/solderable areas fully under the body of the component or protruding to the edge of the component.
- Flexible circuits boards (01/10/2010)
  
  Flexible circuits can have a significant effect on product cost, but their use can provide cost savings when consideration is given to the total cost of the equipment.

Guide To Suppliers

SMART Group

94 Easton StreetHigh WycombeBucksHP11 1LTUnited Kingdom

94 Easton Street
High Wycombe
Bucks
HP11 1LT
United Kingdom