Cadence Design Systems Ltd company details from EPDT Magazine

Guide To Suppliers

Cadence Design Systems Ltd

Bagshot Road
Bracknell
Berkshire
RG12 0PH
United Kingdom

Telephone : +44 (0)1344 360333
Fax : +44 (0) 1344 869647
Web : www.cadence.com

Article archive for Cadence Design Systems Ltd;

- New LC3 codec for Bluetooth LE Audio now available for Cadence Tensilica HiFi DSPs (07/01/2020)
  
  Fresh from its announcement at #CES2020, HiFi customers can immediately benefit from the latest performance enhancements enabled by the new Bluetooth audio mode, including longer battery life, improved connectivity & multi-user sharing.
- Enabling autonomous moral machines (05/01/2017)
  
  The age of the autonomous vehicle is very much upon us. Numerous multinational corporations have thrown their weight behind the concept of autonomous driving, including Google, Apple, Nvidia, and Tesla.
- Production-ready products for hardware engineers (19/01/2016)
  
  Arrow Electronics and Cadence Design Systems will collaborate to bring integrated design tools to engineers.
- FreeRTOS now available for Tensilica Processors (21/04/2015)
  
  Cadence Design Systems announces that the FreeRTOS is now available for Cadence Tensilica processors and digital signal processors (DSPs).
- Design IP drives in-car entertainment and communication systems (20/04/2015)
  
  Ethernet is fast becoming the communications backbone in next-generation cars, supporting high data bandwidth applications like infotainment, ADAS and cameras.
- Foundry-certified SPICE-level accuracy (07/08/2014)
  
  Cadence introduced Voltus-Fi Custom Power Integrity Solution, a transistor-level electromigration and IR-drop solution.
- DSP reduces engine noise inside the vehicle (25/06/2014)
  
  QNX ports Acoustics for Active Noise Control (ANC) software to the Cadence Tensilica HiFi audio/voice DSP core.
- Formal, simulation, and AMBA verification IP combine to verify configurable powerline networking SoC (21/11/2013)
  
  While wireless networking is a convenience, it is only valuable when it works. The HomePlug Broadband power line networking SoC is designed to enable networks over common power lines, extending the Internet to places where wireless networks cannot reach.
- FastSPICE simulator delivers 10X throughput (22/10/2013)
  
  Cadence’s Spectre XPS is a high-performance FastSPICE simulator that enables faster simulation for large, complex chip designs.
- Cadence to acquire Tensilica (12/03/2013)
  
  Cadence Design Systems has entered into a definitive agreement to acquire Tensilica for approximately $380 million in cash.
- Verification accelerates development (30/07/2010)
  
  A fully integrated verification computing platform, Palladium XP from Cadence, unifies simulation, acceleration and emulation into a single verification environment.
- Addressing productivity crisis for SoC design (11/05/2010)
  
  Cadence Design Systems has released Cadence Encounter Digital Implementation (EDI) System 9.1.
- Advancing PCB design (28/10/2009)
  
  Allegro and OrCAD PCB software has been released by Cadence Design Systems. It boasts new features and functionality designed to boost productivity and performance for PCB engineers.
- Solve the routing bottleneck (20/07/2009)
  
  Hitachi cuts place-and-route design time by 40% using Cadence design software for PCBs.
- Function better with power predictability (01/09/2007)
  
  In today’s process geometries, power consumption has become a factor that must be managed in all chip designs. For many types of chips, such as plugged-in applications, this is a new challenge
- What makes a 45nm material world? (01/07/2007)
  
  There could be 45nm silicon widely available by the next quarter. CAROLINE HAYES reports on the material changes that will bring this about, from high-k materials to photo mask printing
- Verification addresses low-power logic (01/04/2007)
  
  As more portable devices need a longer battery life, the need to make power savings is moving to integrated, high-performance, 90nm and below silicon. The lower processes can create heat management issues, which can be resolved by optimising power throughout the chip, writes TOM BRESLIN.
- Cadence lays out holistic approach (01/08/2006)
  
  In today’s design world, there is an increasing integration of RF and mixed signal design with hardware and software integration. These bring technology risks; experimenting with technology under time and budget constraints and make demands on performance and power consumption objectives. Mike Fister, president and CEO Cadence Design Systems identified a holistic approach to the development cycle, at CDNLive! (Cadence Designer Network) conference, last month.

Guide To Suppliers

Cadence Design Systems Ltd

Bagshot RoadBracknellBerkshireRG12 0PHUnited Kingdom

Bagshot Road
Bracknell
Berkshire
RG12 0PH
United Kingdom