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Article archive for Mouser Electronics;
Fully certified, modular Bluetooth 5.2 solutions. Up to 8dBm TX power, -98dBm RX sensitivity, full software stacks, tools and support.
High-speed differential 1-to-2 switch for high signal integrity and minimal crosstalk in PCIe4.0 and other high speed interface applications.
Wide 1.8MHz - 250MHz frequency range, opposite pin connection versions for two-up and push-pull configurations, in a standard TO-247 package.
Auxiliary power supply reference design for three-phase converters, featuring the 1700V CoolSiC™ MOSFET in a single-ended flyback topology.
Microphone coupon board equipped with four MP23DB01HP digital MEMS microphones. 135dBSPL acoustic overload point, 64dBSNR in low power mode.
The single-channel, low-side, non-inverting gate driver features a typical 2.0A source and sink currents in a 6-lead PG-SOT23 package.
AEC-Q200-qualified with 0.3O to 900kO resistance range.
Get Launched is a start-up & incubator support programme that helps companies achieve rapid time-to-production & time-to-market by utilising Microchip’s technical expertise to advise throughout the design process. The global electronics design programme invites designers to submit projects that uniquely feature one or more components from Microchip.
High-voltage contactors, power PCB relays, solid-state relays, general-purpose relays, force-guided relays and more.
Combining a high-performance proximity & ranging sensor with multi-target distance measurements & automatic smudge correction.
Low profile connection of flex printed circuit (FPC) assemblies allows denser PCB stacking possibilities or space for other devices over the board.
ams AS621x with eight I2C addresses provides a 16-bit resolution over the full temperature range from -40°C to +125°C.
Motion-tracking IMU (inertial measuring unit) for ultrasonic-based obstacle detection regardless of object colour, materials or ambient lighting conditions.
Online artificial intelligence (AI) event with industry leaders – including Google, Arduino, Raspberry Pi, Intel, Texas Instruments & NXP Semiconductors – to take place on 9th & 10th September.
High-rated 2.83A to 7.05A current, low 17mO to 94mO DC resistance, 99% coupling factor and AEC-Q200 qualified.
A mechanical alternative to traditional gap pad or thermal interface material for communications & high performance computing (HPC) applications.
Up to 180°C continuous operation, low DCR to minimise losses, soft saturation.
A complete photometric system, using optical dual wavelength technology.
Devices with internal band gap reference, a temperature sensor, and a 16-bit analogue-to-digital converter; available in I2C or SPI versions with ±0.1°C accuracy.
Voltage regulator ICs and power modules that enable cooler, smaller and simpler power supply solutions.