Range of advanced thermal profiling solutions

10 March 2015

SolderStar will be highlighting a number of innovative products at SMT Hybrid Packaging in Nuremberg, Germany from 5 – 7th May 2015.

The increase in microelectronics is growing in its complexity and this brings with it manufacturing problems, especially in the soldering process, however SolderStar will be exhibiting a range of products that helps in this intricate procedure, including the WaveShuttle Selective range.


Patrick McWiggin, Technical Director at SolderStar said consumer electronic goods are still following the trend of increased functionality while physical constraints remain fixed, or in the case of emerging sectors like wearable ‘gadgets’, new manufacturing methods and material are needed for ultra-miniature high technology assemblies. SolderStar solutions are well placed to help with developing the thermal processes for these challenging areas.


Selective soldering is becoming an interesting process and used more, especially in industries that use microelectronics. Due to mixed-technology assemblies and the need for high accuracy SolderStar has advanced its range of selective soldering applications. The latest and most advanced profiler in the range is the Multi-Wave PRO which was developed to allow dedicated test fixtures to be produced quickly and cost effectively for multi-wave soldering machines.


Another innovative development to help in the manufacture of microelectronics is the SolderStar Automatic Profiling System (APS). This profiles each and every PCB soldered in a convection reflow oven. It is ideal for customers who need complete traceability, the system tracks the profile of every assembly that passes through the oven, a necessity in many industries today.


SolderStar will be featuring both these systems at the show, along with a range of other thermal profiling equipment, accessories and software, and demonstrate to visitors how they can help in their manufacturing process. 


SolderStar’s Multi-Wave PRO features measurement sensors which are fitted to a customer’s specific location, and corresponds to the soldering areas within the multi-wave solder pot tooling. This technique provides contact time and difference data quickly allowing engineers to identify any problem areas within the tool design. Any differences in nozzle to PCB contact can be easily measured providing a powerful platform for process capability analysis, improvement and on-going testing.


SolderStar APS is a full time system for profiling each and every PCB soldered in a convection reflow oven. Every system is tailored for, and fitted to a customer’s oven so their requirements are met precisely. Special temperature probes are mounted along the heated length on both sides of the machine to monitor actual product level temperatures in real time. In addition to this, the system keeps track of the current speed and position of each assembly and has recently been re-engineered so the temperature probes are smaller, allowing them to be positioned closer to the PCB providing a much more accurate temperature measurement in the vicinity of the electronic assembly during soldering process. The APS system allows 100% checking of temperature profiles, an automatic analysis of the profile, and checking of production parameters against production limits. The computer software tracks the progress of the PCB through the oven allowing for the most accurate calculation of the profile seen at product level.


SolderStar will be in Hall 7 stand 516.


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