New generation of wireless modules
16 February 2015
HUAWEI has unveiled the MU709s, an industrial module based on the company’s in-house HiSilicon chipset, Balong 330.
Meeting the highest quality standards, the module supports M2M industrial applications such as remote control and monitoring, 3G routers, gateways and telematics.
MU709s is a HSPA+ M2M module that is available in two different versions: Dual-band for the European market and Tri-band for the Latin-American market. It supports data speed up to 21.6 Mbps in downlink and up to 5.76 Mbps in uplink. Both versions support Quad-band EDGE/GPRS/GSM as well as various features, including: HTTP, FTP, FOTA, Jamming Detection, Netscan, Cell lock, CMUX and eCall. The new module comes in a compact form factor of 30 x 30 x 2.3mm and 146 pin LGA package, making itpin compatible with the entire LGA product family of Huawei MU509, MC509, MU609 and ME90, making for easy migration from one technology to another The MU709s is also available with an miniPCIE interface.
The MU709s delivers excellent radio performance, robust signal reception, adjacent channel leakage ratio for better anti-interference for the receiver, rapid network registration time as well as longer battery driven operation for its class. It is also equipped with a complete set of software features and therefore very easy to integrate in any kind of application.
This module is the first model of a new generation of products based on HiSilicon chipsets. HiSilicon is the biggest fabless chipset vendor in mainland China, with more than 6000 employees and 14 R&D centres worldwide. Its products have been globally deployed more than 200 million times in a huge variety of devices. In June 2015, another LTE module ME909s will be launched in the European market. Along with the Balong 711 it will combine 8 LTE bands in one module and deliver Cat.4 LTE speeds up to 150 Mbps – which will enhance the regional coverage and service stability.
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