Bluetooth-based RF SoC maintains power budget
22 July 2014
Based on the Nordic Semiconductor nRF51822 SoC, the LG 4403 Bluetooth Smart SiP module measures just 5.3 x 4.7 x 1mm.
It is small enough to fit into any current or next generation smartphone, tablet, or computer app-cessory or sensor no matter how miniaturised, says LG Innotek.
The LG4403 carries little or no size penalty compared to a discrete (individual component-built) solution and requires no RF expertise to employ. It is supplied in an LGA package small enough to fit into any current or next-generation Bluetooth Smart smartphone, tablet, or computer app-cessory including the smallest wearable, smart watch, sports, health, and Internet of Things (IoT) devices.
The module also includes a 32bit ARM Cortex M0 microprocessor, 256kbyte of Flash memory, and full range of analogue and digital peripherals (including GPIO, ADC, SPI, I²C and UART): a 32 MHz high stability X-Tal quartz oscillator, fully-matched RF matching circuit, 19 GPIOs (general purpose input/outputs), and can run from 1.8 to 3.6V power source.
Power consumption is a claimed typical performance of 10.5mA for transmission (TX), 13mA for reception (RX), and 0.6µA for deep sleep mode. RX sensitivity is quoted at -93dBm at 1Mbit/s data transfer rates, and TX power -20 up to +4dBm.
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