Avionics power module uses GaN technology

15 July 2014

MACOM announces two-stage, fully matched GaN surface mount power modules, which it has added to its GaN in Plastic power modules.

They are optimised for pulsed avionics applications in the 960 to 1215MHz band, and scale to peak pulse power levels of 100W in a 14 x 24mm package size.

The high gain GaN in Plastic modules support surface mount technology assembly, and are claimed to provide significant cost and process advantages compared to ceramic-packaged flange-mount components. Delivering clear benefits in size, weight and power (SWaP) while enabling high volume manufacturing efficiency, they feature a land grid array pattern for enhanced thermal flow and “True SMT” assembly and do not require copper coining or complicated thermal management techniques on the system PC board.

Under pulsed conditions, the modules deliver output power greater than 90W, with 30dB a typical associated power gain and 60% typical power added efficiency. Supporting 50V operation and up to 3ms pulse width/duration for improved signal flexibilty, the modules reduce overall power consumption and cooling requirements compared to existing options, says the company. 

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