0.27mm claims world record in thin plastic packaging
12 November 2013
Lo-Z ETDFN package is claimed to set a world record in thin plastic packaging with the introduction of a GreenFET load switch.
Silego Technology has introduced the Lo-Z ETDFN (Extreme Thin DFN) package and used the flip chip on lead frame packaging technology to achieve a 0.27mm thin package.
The package height allows active semiconductor devices to be placed into height constrained regions of a PCB, traditionally reserved for thin passive devices, says the company, which could open up form factor possibilities for handheld mobile devices and wearable consumer electronics.
The company will deploy the package as an option for its product families, including the GPAK programmable mixed-signal matrix and GCLK 32.768 kHz crystal replacement families.
In comparison to WLCSPs, the technology is half the package height, claims the company, and provides additional protection from ambient light and cracking which can be associated with handling WLCSPs. The mechanical design allows standard PCB manufacturing flows to handle the Lo-Z device.
The first product in the package is the SLG59M1493Z GreenFET3 load switch. The 8pin single channel load switch (1x1.6x0.27mm) supports a linear voltage ramp control with adjustable ramp rate. The device switches power rails from 1- to 5V up to 2.5A continuous. The Rds(ON) is rated and regulated at 17mO.
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