Miniaturised multi-layer chip bead is compact

22 May 2013

A miniaturised multi-layer chip bead series in case size 0603 (EIA 0201) saves volume and area, says TDK.

The MMZ0603-E multi-layer chip beads have compact dimensions of just 0.6x0.3x0.3mm³ and are 80% smaller in volume and 65% less in area than existing MMZ1005-E types with comparable performance. There are two high-impedance versions, one rated for 600O and the other for 1000O at 100MHz. Both types offer even higher impedance values at 1GHz of 1000 and 1800O, respectively.

This means a single component can cover a wide frequency range, ensuring highly efficient noise attenuation. The multi-layer chip bead is suitable for eliminating noise in compact mobile devices, especially in smartphones that must operate with multiple communication frequency bands. The miniaturisation of chip beads was made possible by the company’s Gigaspira production technology, which creates a micro-coil winding that is perpendicular to the terminal electrodes, effectively suppressing stray capacitance from the terminals. 


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