Collaboration provides advanced silicon photonics
07 May 2013
Prototyping company MOSIS collaborates with Imec, Tyndall and ePIXfab to offer advanced silicon photonics technology.
MOSIS has teamed up with ePIXfab, the European Silicon Photonics support centre providing prototyping services for photonic ICs in a partnership that gives customers access to Imec’s integrated silicon photonics processes and Tyndall’s advanced silicon photonics packaging technology. Imec’s silicon photonics platform enables cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gbit/s and beyond) for telecomms, datacomms, and optical sensing. Its Si photonics 200mm wafer platform offers tight within-wafer silicon thickness variation and three-level patterning of 220nm top Si layer (193nm optical lithography) and poly-Si overlay and patterning (193nm optical lithography). There are three-level n-type implants and three-level p-type implants in Si.The integrated components include low-loss waveguides, efficient grating couplers, high-speed silicon electro-optic modulators and high-speed germanium waveguide photo-detectors. A design kit to access imec technologies will be provided. Tyndall National Institute, a partner of ePIXfab, offers the ability to provide packaged silicon photonics devices. This includes the design and fabrication of custom photonic packages, fibre coupling (single and arrays) and electrical interconnects. Designs rules to support these packaging capabilities will also be provided.
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