Deutsche Telekom and Digi International collaberate

16 October 2012

Digi International and Deutsche Telekom announced a collaboration to enable easy access and control of remote devices used in M2M applications throughout Europe.

Digi will integrate Deutsche Telekom’s industrial-grade SIM cards into its wireless gateways and routers and M2M SIM management functionalities into the iDigi Device Cloud.

Digi M2M solutions are used in numerous applications, such as connecting and monitoring remote assets like storage tanks, vehicle fleets, solar power arrays and other remote devices. Therefore, Digi’s M2M solutions are often used in places where rough weather, movement, vibrations and extreme temperatures can interfere with the optimal functionality of integrated SIM cards.

Deutsche Telekom offers special M2M Form Factor (MFF) SIM chips, designed for the purpose of reliable usage under extreme weather and temperature conditions. Digi will be the first gateway and router manufacturer to integrate Deutsche Telekom’s M2M Form Factor SIM chips. Since the chips are soldered into place, the possibility of a plastic SIM becoming loose from vibration in transit or while deployed is eliminated. Extreme heat or cold temperatures will not damage the chip, and chips are safely protected against moisture.

To further their collaboration, Deutsche Telekom M2M and Digi are integrating the SIM management functionalities of Deutsche Telekom’s M2M Service Portal into the iDigi Device Cloud, allowing customers to manage their devices and SIM cards in one central location.

Solution architects are available from both organisations to help customers design end-to-end M2M solutions using Digi products and iDigi Device Cloud over the Deutsche Telekom carrier network. Digi gateways with Deutsche Telekom MFF SIM chips are available now.


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