More reasons than ever to visit NEW:UK 2012
16 April 2012
Bob Willis, POP Centre Co-ordinator
“Spend a couple of hours with the POP Team and you will have a significant advantage when specifying or implementing this technology in the future”
That’s according to Bob Willis, POP Centre Co-ordinator (pictured). Package on Package (POP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on design and assembly engineers. POP is also finding favour in professional handheld tablets and commercial high reliability applications?
Package on package is new to many engineers but ready to explode in the market place
In simple terms PoP represents the stacking of area arrays one on top of another, either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include flip chip, wire bonding or conductive adhesives for device to device interconnection. The second generation of devices feature finer pitch and through vias for greater interconnection.
PoP is new to many contract and OEM assembly staff but with the demands of paste or flux dipping, reflow warpage, increased placement accuracy and flexability during paste application during assembly and rework gaining knowledge and experience is vital your competitive edge. The difficulty in multi level ball inspection can be a challenge for standard x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.
What will you see or learn at the PoP Centre?
• PoP components explained
• PCB design rules and PCB specification
• Changes necessary in the assembly process
• In process inspection criteria
• Solder joint reliability data
What will you see live at the POP Centre?
• Placement of PoP
• In process Inspection of package assemblies
• Application of dip paste and dip flux
• Rework of POP and inspection
• POP process defects – causes and cures
What benefits will your company get from visiting the POP Centre
• Learn PoP Technology from A-Z
• Handle PoP samples
• Faster implementation of the technology
• Obtain inspection standards for your line
• Hands on assembly, inspection and rework
Package on Package (POP) Defect – Causes & Cures
Even if you are running package on package, there are solutions for you. This year the POP Centre will give you the opportunity to have your POP failures or process defects examined by recognised experts on the subject. You can bring board assemblies, components, and failure analysis reports for discussion and free advice to help you pin point the true cause of failure. You can email your questions or problems before the show and book an appointment. Email your photographs and problems prior to your visit to: firstname.lastname@example.org
Package On Package Technology Supporters
• ALR Printed Circuits
• Nordson DAGE
• O’Dell Rework
• Practical Components
• ZEN Production Equipment
• ZPEL –Asscon
Package on Package (POP) Design & Assembly Centre Seminars
Attend the daily 30min seminars and you and your company will receive a copy of each of the slides and access to a video library of each of the presentations to assist your company staff to successfully implement PoP. This is unique and repeated daily.
11:00 Design Guidelines for PoP – Bob Willis
12:00 Assembly Process Challenges with PoP – Edwin de Blauw, MYDATA
13:00 Inspection Guidelines for Package on Package – Keith Bryant, DAGE
14:00 How to Rework POP Assemblies with Confidence – Jason O’Dell, O’Dell Rework
SMTA Technical Library on PoP Technology
Visitors to the POP Centre will benefit from exclusive access to over 200 technical papers covering Package on Package and stacked packaging technology.
This is a unique opportunity to access and learn from one of the largest collection of technical papers made possible by SMTA. “Having worked for many years with SMTA, a worldwide organisation I know the quality of the material and it’s great to be able to access this resource for NEW visitors” said Bob Willis the POP Design & Assembly Centre Organiser.
Having the opportunity to learn from so many sources will make a company’s introduction of POP so much easier. The hundreds of technical papers focus on design, assembly, reliability and so much more.
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