A new method for PCB production

31 January 2011

AT&S Austria Technologie & Systemtechnik has filed a patent. The patent they have taken out is for a method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board’.

According to the translated abstract posted by the World Intellectual Property Organisation:

“In a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions (20, 21, 22) to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions (20, 21, 22) to be connected to one another, at least one additional layer or ply of the printed circuit board is arranged or applied over the printed circuit board regions (20, 21, 22) to be connected to one another, it is provided that the additional layer is embodied as a conductive layer (26), which is contact-connected via plated-through holes (23) to conductive layers or devices or components integrated in the printed circuit board regions (20, 21, 22) to be connected to one another, as a result of which a simple and reliable connection or coupling of printed circuit board regions (20, 21, 22) to be connected to one another can be made available. Furthermore, a printed circuit board consisting of a plurality of printed circuit board regions (20, 21, 22) is made available.”


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