THIS WEEK’S BIG EVENT – SMT/HYBRID/PACKAGING 2009

04 May 2009

SMT/HYBRID/PACKAGING 2009

From 5-7 May 2009, one of Europe´s leading events on System Integration in Micro Electronics is being held in Nuremberg.

More than 540 exhibitors are expected to cover the 25,800sq-metre exhibition area, and the show promises to present the latest trends and developments as well as up-to-date solutions. With foreign companies accounting for 33% of the exhibitors, the event offers a wide, international spectrum.

From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products under one roof.

Click here to read about this event in our comprehensive Events diary.


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