Chip Attenuators for Mission-Critical Application Scenarios

22 June 2024

MIL-PRF-55342 qualified, the TSX WB2 series of surface-mount chip attenuators from Smiths Interconnect deliver strong performance and high reliability, while being housed in a compact (404 size) form factor.

These components have 1W to 3W power handling capabilities. They can deal with frequencies of up to 50GHz - with the upshot that the wider coverage exhibited will allow a single component to be employed for multiple functions (thereby lowering the component count, space utilisation and overall system costs). Various attenuation values are offered, namely 1dB to 10dB, then 15dB, 20dB and 30dB. Tight attenuation tolerances are always upheld. Key applications for these attenuators include space, defence, avionics, etc. 

“The TSX series is a cost-effective wire bondable attenuator solution”, states Tullio Panerello, VP for Fibre Optics & RF Components at Smiths Interconnect. "It provides another chip attenuator option with excellent attenuation performance, compact in size and provides MIL spec test data for program assurance.”

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