Ultra-High Speed Chiplet-Enabled Connectivity Solution

20 June 2024

Comprised of a PHY plus dedicated controller IP, Alphawave Semi has just introduced a game-changing subsystem for delivering accelerated connectivity speeds to high-performance computing (HPC) and next-generation data centre installations.

Based on Micron’s HBM3E memory technology, alongside Alphawave's own proprietary silicon interposer structure, this subsystem has a 2.5D stacked construction. It is capable of supporting 9.2Gbits/s data rates - which means that chiplet-enabled memory bandwidths reaching 1.2TBytes/s can be realised. This will be invaluable in relation to dealing with generative artificial intelligence (AI) workloads, providing an effective yet power frugal solution. 

“Micron is committed to advancing memory performance through our comprehensive AI product portfolio as the demand for AI continues to grow in data centres,” comments Praveen Vaidyanathan, Micron’s VP for Compute Products. “With their end-to-end channel simulations, we are pleased to see Alphawave Semi demonstrate a performance of 9.2Gbits/s for AI accelerators with HBM3E. Together, we are empowering customers to accelerate system deployment with our Micron HBM3E solutions, delivering up to 30% lower power consumption compared to competitive offerings.”

“We are excited to lead the industry in delivering a complete 9.2 Gbps HBM3E PHY and controller chiplet-enabled platform delivering 1.2TBytes/s bandwidth, backed by channel simulations across the SoC, interposer and Micron’s HBM3E memory,” adds Mohit Gupta, SVP for Custom Silicon & IP at Alphawave. “Leveraging this, along with our leading-edge custom silicon and advanced 2.5D/3D packaging capabilities, allows Alphawave Semi to a provide a very significant time-to-market advantage to our hyperscaler and data centre infrastructure customers for their AI-enabled systems.” 

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