Streamlined 3D Imaging Benefits from hToF Technology

01 February 2024

Working alongside OMS and pmdtechnologies, Infineon engineers have developed a compact, high-resolution 3D imaging solution with accentuated depth sensing capabilities.

Using a hybrid time-of-flight (hToF) mechanism, the REAL3 imaging unit draws on a combination of indirect and direct ToF principles, with their respective flood illumination and long-range spot illumination arrangements. The upshot of this combination is that detailed 3D mapping of a scene can be constructed (even in intense sunlight or poor illumination conditions) - so that obstacles can be identified and navigated around. The imager attains superior performance, while also having far smaller physical dimensions than conventional ToF implementations. It is accommodated in a 31mm x 16mm x 8mm housing. Among the places in which it will be of value are robotic vacuum cleaners, commercial robots and suchlike, where it can contribute to substantial reductions in imaging system size.  

“The partnership with pmdtechnologies and OMS is a great example of how Infineon fosters technology innovation and digitalization together,” states Andreas Kopetz, Infineon’s VP Ambient Sensing. “Our hybrid ToF solution caters to a rapidly expanding consumer robotic market with a wide array of applications and makes it possible for customers to come up with unique robot designs, on top of reduced system costs and complexity by one camera replacing multiple.”


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