TI Begins Construction of 2nd Utah Fab - Which Will Set New Industry Sustainability Benchmarks
07 November 2023
Work has just commenced on a large-scale 300mm semiconductor wafer production facility in Utah’s ‘Silicon Slopes’ technology cluster. Representing an $11 billion investment by American IDM Texas Instruments (TI), this new fab will complement its already operational one at the Lehi site. Once construction has been completed, in the early 2026 timeframe, the company’s device production output will be boosted significantly.
The objective that has been set out is for this fab to be powered completely via electricity from renewable sources. It will also be much more efficient in its water usage too. The expectation is for the facility to directly generate a further 800 roles within TI itself, as well as numerous ancillary jobs around the Lehi area too. For the groundbreaking ceremony, TI’s CEO Haviv Ilan was joined by the Governor of Utah, Spencer Cox.
“Today we take an important step in our company’s journey to expand our manufacturing footprint in Utah. This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” Ilan commented. “At TI, our passion is to create a better world by making electronics more affordable through semiconductors.”
“TI’s growing manufacturing presence in Utah will be transformative for our state, creating hundreds of good-paying jobs for Utahns to manufacture critically important technology,” Governor Cox added. “We are proud that semiconductors - made in Utah by Utahns - will power the innovation that is foundational to our country’s economic and national security.”
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