onsemi Boosts SiC Production Capacity of South Korean Fab to 1 million wafers per year

25 October 2023

Underlining its strong commitment to furthering the progression of wide bandgap (WBG) semiconductor technology, onsemi has succeeded in expanding the capacity of its silicon carbide (SiC) device manufacturing site in Bucheon, South Korea.

Its output will now be ramped up, with 150mm diameter SiC wafers being produced for the moment, but then switching over to 200mm wafers in 2025. After this point, the fab will to be fabricating at least million 200mm SiC wafers annually. This expansion will also help to generate new jobs in the area, with the company recruiting 1,000 staff over the next 3 years (predominantly for skilled engineering roles). This translates into more than a 40% increase in the existing workforce (of approximately 2,300). 
The opening event was attended by leading figures from the South Korean government and industry bodies, as well as high-level onsemi executives. Among those present was onsemi’s CEO, Hassane El-Khoury. He commented that; “The 150mm/200mm SiC wafer fab in Bucheon is critical to the continued success of our fully integrated SiC supply chain, enabling us to support the acceleration of electrification globally. The last five years have shown what extraordinary performance our Bucheon team is capable of, and what we can achieve when we work together with governmental agencies toward the common goal of a more sustainable future.”
“I am truly impressed by onsemi’s diligent and yet fast execution of its strategic plan to expand the Bucheon SiC wafer fab,” added YongEek Cho, Bucheon City Mayor. “Not only will the city of Bucheon benefit from the creation of new employment opportunities in technology, but it will also be a part of laying the foundation for a sustainable ecosystem through electrification.” 

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