Stacked Multi-Chip MLCCs Save Board Space

22 September 2023

By connecting multiple MLCCs together into single surface-mountable units, passive component manufacture KEMET’s KONNEKT technology has successfully been able to assist engineers in producing higher density electronic system deployments.

This product line is now available via the Rutronik distribution network. The transient liquid phase sintering (TLPS) material used here is pivotal - with a low melting point alloy reacting at low temperature with a high melting point alloy to form a reactive matrix. It means that components can be connected without the need for a metal frame - thereby curbing the equivalent series resistance (ESR), equivalent series inductance (ESL) and thermal resistance figures involved. By stacking components together it is possible to save a significant amount of PCB real estate. Key uses include electric vehicle (EV) charging infrastructure, wireless charging systems, solar inverters, data centres and power conversion equipment. 


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