Winbond & Mobiveil Work Together on Ultra-Low Power Memory Controller IP

18 September 2023

Winbond engineers have been collaborating with their counterparts at IP vendor Mobiveil on a new controller technology for engineers to use in their SoC development work.

Targeting various end applications, including automotive, IoT, industrial automation, wearable devices, wireless headsets and smart speakers, the highly optimised controller can be employed in conjunction with Winbond's power-efficient HYPERRAM memories (which have up to 512MByte capacities and supports 250MHz operation). With in excess of 400 million units already shipped, HYPERRAM devices low power budget means they are well suited to battery-run systems. Their streamlined small pin count design makes them very effective in space-constrained deployments.

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