Dispensable Thermal Gel Attends to Thin Bond Line Demands

17 August 2023

Parker Hannifin’s Chomerics division has announced a new addition to its range of thermal interface materials.

Intended for use in very thin bond lines (significantly below 0.50mm), THERM-A-GAP GEL 50TBL is a dispensable thermal gel that offers 5W/m-K bulk thermal conductivity. At a minimum bond line thickness of 0.05mm, the apparent thermal conductivity is still at least 10W/m-K. This new thermal gel needs no mixing or secondary curing - supporting simple application, with potential to undertake rework. It offers a 25g/min flow rate when using a 30cc syringe with an2.5mm orifice (at 621kPa). Application of a very low compressive force is needed, meaning components, solder joints and leads are subject to minimal levels of stress. An operating temperature range of -55°C to +200°C is covered. Among the scenarios that this gel is targeted at are automotive electronic control units (ECUs), telecommunication network hardware, consumer electronics equipment, etc. 


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