Gap-Filling Thermal Interface Solution

08 July 2023

Parker Hannifin’s Chomerics division has just introduced the THERM-A-GAP PAD 80 high-performance gap filler pad.

This product, which comes in standard thicknesses from 0.5mm to 5.1mm, will be highly effective in thermal management. Its 8.3W/m-K thermal conductivity enables industry-leading heat dissipation.

As well as having strong thermal conductivity properties, this product maintains low compression forces and conformability between mating surfaces. Consequently it can deflect assembly pressures - thereby minimising the stress placed onto components, soldered joints, PCB leads, etc. Its constituent material also exhibits low silicone oil bleeding, thereby minimising the potential for greasy residues to accumulate on the surface of the heatsink or substrate during use. In addition, it meets NASA outgassing requirements. This solution will be applicable to engineers creating telecom infrastructure, home automation equipment, automotive electronic modules, electric vehicle charging units, power supplies, computing hardware and servers.

As Ben Nudelman, Chomerics’ Global Marketing Manager, notes; ”With THERM-A-GAP™ PAD 80 we have addressed this need, delivering a product with the necessary thermal conductivity, conformability and reliability to succeed in highly challenging applications.”

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