IGBT/SiC Module Gate Driver Devices with Temperature Readout
16 May 2023
Another highlight from PCIM 2023 was the SCALE-iFlex LT NTC family of IGBT/SiC module gate drivers from Power Integrations.
These devices address the popular new dual-type, 100mm x 140mm format IGBT modules now being seen on the market - like Mitsubishi’s LV100 and Infineon’s XHP 2, as well as silicon carbide (SiC) variants thereof. They provide negative temperature coefficient (NTC) data to assist with thermal management of power converter systems. This is particularly important for systems where multiple modules have been implemented in parallel - ensuring current sharing is conducted effectively and resulting in improved overall system reliability.
According to Thorsten Schmidt, Product Marketing Manager at Power Integrations; “Designers of renewable energy and rail systems using SCALE-iFlex drivers already benefit from increased system performance; the SCALE-iFlex approach handles paralleling so expertly that one module in five can be eliminated without loss of performance or current de-rating. Adding an isolated NTC output reduces hardware complexity - particularly cables and connectors – and contributes to system observability and overall performance.”
Based on Power Integrations' proprietary SCALE™-2 technology, the enhanced current sharing accuracy achieved by the new drivers substantially increases the current carrying capability of multiple-paralleled modules (with a 20% rising normally being experienced).
In order to enable further space saving, up to 4 MAG-driven power modules can be parallel-connected from a single 2SILT1200T isolated master control (IMC) unit. The gate drivers are fully qualified to IEC 61000-4-x (EMI), IEC-60068-2-x (environmental) and IEC-60068-2-x (mechanical) specifications, and undergo complete type testing - low voltage, high voltage, thermal cycling - shortening designer development time by 12 to 18 months.
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