Highly Versatile Multi-Row Board-to-Board Interconnects with Innovative Stacked Construction

04 May 2023

Featuring a proprietary snap-in biscuit design, the multi-row board-to-board (BTB) interconnects introduced by Interplex enable contact counts to be ramped up as system requirements dictate. Multiple units are very simple to stack together - meaning interconnections can be appropriately sized without the complexities of custom solutions being called for.

The new Interplex connectors have automotive-grade robustness. They incorporate the company’s 0.4mm miniPLX press-fit pins, meaning soldering is not required. These pins have a copper alloy construction and exhibit a <1mO contact resistance. Each pin has a 3A current carrying capability. Board stacking heights between 7mm and 30mm are available, with contact configurations from 1 to 6 rows (with up to 30 contact terminals in each row). Key application scenarios for these connectors include vehicles’ electric power steering systems and electronic control units (ECUs), as well as robots, trains and medical imaging equipment.   

According to Ralph Semmeling, Product Portfolio Director at Interplex; “Being able to fit enough interconnect terminal pins into a small space, while not having any excess, is a priority for any of our clients. At the same time, keeping their total cost of ownership down is also vital. This means that the companies we are dealing with want access to off-the-shelf products at attractive price points, but with the inherent flexibility that following a custom-based strategy offers. Our new stackable interconnect platform gives them the best of both worlds. Allowing them to design to cost.”  


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