Texas Instruments at electronica: driving electrification forward

27 October 2022

Semiconductor firm, Texas Instruments (TI) will showcase technologies that are “Driving Electrification Forward” at electronica 2022, the leading electronics show & conference in Europe, running from November 15-18 in Munich, Germany.

TI experts will demonstrate the latest advancements in electric vehicle (EV) charging, vehicle electrification, advanced driver assistance systems (ADAS) & robotics. Visit TI in Hall C4, Booth No. 157, or see ti.com/electronica for more information.

For many years, TI has participated at the electronica conference to demonstrate innovative analogue and embedded processing products, reference designs and engineering expertise.

TI Live! at electronica” demonstrations focus on these areas:
•    EV charging interoperability: TI will have the industry’s first technology demonstration of an EV charger design supporting the Matter protocol to enable seamless home automation connectivity to monitor and manage EV charging. The demonstration also highlights TI’s latest connectivity products to support Wi-Fi® and Sub-1 GHz, as well as a Sitara™ processor with Linux for secure connections between EV charging stations. These processor and connectivity technologies support the ISO 15118 interface standard for vehicle-to-grid communication, including plug-and-charge capability for fully automated charging.
•    High-power bidirectional EV charging: TI will also have a live demonstration of a highly efficient, three-phase 11-kW AC/DC bidirectional rectifier/inverter with a gallium nitride (GaN) and silicon carbide (SiC) reference design. This charging demonstration achieves up to 99% efficiency and power density higher than 2 kW/L. TI also plans to demonstrate two single-phase GaN-based rectifier designs for industrial power delivery that achieve the industry’s highest power density.
•    Smarter, safer autonomous mobile robots: TI will leverage several technologies, including its latest Jacinto™ processor for vision analytics, and sensor fusion of data from cameras and TI mmWave (millimetre wave) radar sensors to enable 360-degree obstacle detection and avoidance. The demonstration features real-time motor control with TI’s C2000™ MCUs (microcontrollers) and a DLP® technology-based human machine interface module, providing timely safety alerts for safe motion and human interaction.
•    Edge AI-enabled industrial robots: TI will show a collaborative robot arm that demonstrates how it can safely and intelligently interact with human gestures. A second industrial demonstration will feature a cloud-connected plotter leveraging a Sitara MCU for real-time control, latency multiaxis control and Ethernet connectivity to help achieve predictive maintenance.
•    Vehicle electrification: TI will demonstrate an isolated power system for traction inverters and onboard charger systems. The design can drive various power switches with extremely high efficiency, including a SiC field-effect transistor module. A second powertrain demonstration will showcase a high-speed traction inverter powered by a Sitara MCU, the first device to achieve real-time control greater than 20 kRPM and functional safety on a single device.
•    Driver assistance: Visitors to the TI booth can interact with an ADAS wall display that features various 77-GHz TI mmWave radar sensors enabling edge intelligence at different locations on the vehicle.

TI will add videos of the these demonstrations and more to its electronica microsite November 11.

TI speaking sessions at electronica include:
•    “The Importance of Cybersecurity Risk Analysis in Embedded Systems Design” presented by Erik Shreve, TI software security analyst, Nov. 16 at the Electronic Specifier Cybersecurity Forum (Hall B4, Stand 259).
•    “How the IoT has evolved to make way for Matter” presented by William Goh, TI connectivity product systems engineer, on Nov. 16 at Embedded Forum (Hall A4, Stand 473).
•    “A Functional Safety-Relevant Communication in Automotive Wireless Battery Management System” presented by Tomas Urban, a TI automotive systems engineer, Nov. 16 at the Wireless Congress (ICM – International Congress Center Munich, Messegelande, Entrance West).

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