Toshiba launches third generation 650V silicon carbide (SiC) MOSFETs

30 August 2022

New devices will enhance efficiency & reduce size in industrial power electronics applications.

Toshiba Electronics Europe has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

These highly efficient and versatile products will be used in a variety of demanding applications, including switch mode power supplies (SMPS) and uninterruptible power supplies (UPS) for servers, data centres and communications equipment. They will also find applications in renewable energy, including photovoltaic (PV) inverters and bi-directional DC-DC converters, such as those used for electric vehicle (EV) charging.

The new TW015N65C, TW027N65C, TW048N65C, TW083N65C and TW107N65C are based upon Toshiba’s advanced third generation SiC process which optimises the cell structures used in second-generation devices.

As a result of this advancement, a key figure of merit (FoM) calculated as the product of drain-source on-resistance (RDS(on)) and gate-drain charge (Qg) to represent both static and dynamic losses has improved by about 80%. This significantly reduces losses and allows power solutions with higher power densities and lower running costs to be developed.

In common with earlier devices, the new third-generation MOSFETs include a built-in SiC Schottky barrier with a low forward voltage (VF) of -1.35V (typ.) to suppress fluctuation in RDS(on), thereby enhancing reliability.

The new devices are able to handle currents (ID) up to 100A and feature RDS(on) values as low as 15m?. All devices are housed in an industry standard TO-247 package.

Shipments of the new MOSFETs starts today.

Further information is available here:

TW015N65C, TW027N65C, TW048N65C, TW083N65C and TW107N65C

About Toshiba Electronics Europe
Toshiba Electronics Europe GmbH (TEE) is the European electronic components business of Toshiba Electronic Devices & Storage Corporation. TEE offers European consumers and businesses a wide variety of innovative hard disk drive (HDD) products, plus semiconductor solutions for automotive, industrial, IoT, motion control, telecoms, networking, consumer and white goods applications. Next to HDDs, the company’s broad portfolio encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors, as well as microcontrollers and application specific standard products (ASSPs), among others
TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services. For more company information, visit:

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