EPDT July 2022 issue (inc. Electromechanical + Military & Aerospace features + Distribution supplement) now available online
02 July 2022
EPDT July 2022 cover image
This month’s issue, now available in print or digital editions, contains features on Electromechanical technologies and Military & Aerospace applications, plus the latest edition of EPDT's twice-yearly Electronics Distribution supplement.
In the run-up to International Women in Engineering Day, my Editor's Comment this month reviews data from EngineeringUK’s latest ‘Women in Engineering’ briefing... (p4 digital issue or web version).
The sponsored cover story sets out how a value-added distributor committed to a quality ethos throughout its business can help its customers realise huge benefits (p6 digital issue or web version).
For Military & Aerospace, we include a case study explaining how proven modular power-delivery solutions are simplifying aerospace design and reducing time-to-market for a pioneering electric aircraft (p8 digital issue or web version); and we explore how high data speeds, miniaturisation and improved functionality are increasingly placing new demands on the connectivity and infrastructure in the next generation of avionics (p12 digital issue or web version).
For Electromechanical, we include a tutorial on thermal interface materials (TIMs) for thermal management in electronic devices (p15 digital issue or web version); we explain why the M12 connector is an ideal connectivity solution for the tough environment of the factory floor (p17 digital issue or web version); and we outline how industrial electronic enclosures are evolving to match the ever-accelerating pace of change in the sector (p19 digital issue or web version).
EPDT July 2022 Electronics Distribution supplement H2 cover image
The latest edition of EPDT's bi-annual Electronics Distribution supplement (p21 digital issue) opens with an intro from the ecsn (Electronic Components Supply Network) Chairman, reviewing industry performance and supply chain issues – including geopolitical factors (p22 digital issue or web version). We include Q&As with two component distributors to get their thoughts on the current state of the market (p26 digital issue or web version and p28 digital issue or web version); and we review 10 tips for electronics design engineers to help minimise the effects of supply chain disruptions and keep their projects on track (p30 digital issue or web version).
And finally, for T&M, we explain how flaws in manufactured PCBs can be detected precisely and reliably by molecular fingerprinting with infrared spectroscopic analysis, or so-called FT-IR analysis (p32 digital issue or web version).
As always, I hope you enjoy the issue – and I’d love to hear what you think or any ideas for topics you’d like EPDT to cover. You can email me at mark.gradwell@imlgroup.co.uk...
Mark Gradwell
Editor
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