EPDT June 2022 issue (inc. RF & Wireless + Industrial features + IoT & Industry 4.0 supplement) now available online
Author : Mark Gradwell | Editor | EPDT
02 June 2022
EPDT June 2022 cover image
This month’s issue, now available in print or digital editions, contains features on RF & Wireless and Industrial, plus a show preview for embedded world and the latest edition of EPDT's IoT & Industry 4.0 supplement.
My Editor's Comment this month returns to a familiar refrain: UK engineering needs to be celebrated! Festival of engineering, anyone?... (p4 digital issue or web version).
Our cover story (p28 digital issue or web version) talks IoT asset tracking – which combines sensing, positioning & communications technologies to enable remote monitoring of real-time geolocation, status or condition – in a Q&A for the IoT & Industry 4.0 supplement. And we preview the return of embedded world (p6 digital issue or web version).
For RF & Wireless, we investigate the effect that power designs have on the phase noise of RF amplifiers (p10 digital issue or web version); and outline some of the industries and application spaces taking advantage of smart wireless technologies (p19 digital issue or web version).
For Industrial, we explore the potential future of quantum computing for manufacturing (p14 digital issue or web version); and we outline some of the reasons behind – and strategies for mitigating – recent supply chain price hikes for system integrators & OEMs using industrial computers or IIoT devices in their systems (p16 digital issue or web version).
EPDT June 2022 1H IoT & Industry 4.0 supplement cover image
Our bi-annual IoT & Industry 4.0 supplement (p21 digital issue) opens with a guest intro from new Connectivity Editor, Gordon Wong offering a light-hearted exploration of IoT adoption (p22 digital issue or web version). We also give an overview of MQTT, one of the most widely adopted communications protocols for the growing category of low-power wide-area networks (p23 digital issue or web version); and we explain why, as the IoT era evolves into the Internet of Everything (IoE), low price is becoming the most significant chip design consideration (p26 digital issue or web version). Plus, we include a Q&A talking IoT asset tracking (p28 digital issue or web version) – which combines sensing, positioning & communications technologies to enable remote monitoring of real-time geolocation, status or condition.
And finally, for T&M, we explain why regular calibration of instrumentation is vital to ensure that T&M kit continues to meet published performance specifications (p32 digital issue or web version).
As always, I hope you enjoy the issue – and I’d love to hear what you think or any ideas for topics you’d like EPDT to cover. You can email me at mark.gradwell@imlgroup.co.uk...
Mark Gradwell
Editor
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