EPDT February 2022 issue (inc. Embedded & Mil/Aero features) now available online

Author : Mark Gradwell | Editor | EPDT

03 February 2022

EPDT February 2022 cover image
EPDT February 2022 cover image

This month’s issue, now available in print or digital editions, contains features on Embedded technologies & Mil/Aero applications.

My Editor's Comment this month looks at how Europe might strengthen its microelectronics ecosystem through a long-term, forward-looking semiconductor chip manufacturing strategy & regulatory framework (p4 digital issue or web version)…  

Meanwhile, our cover story (p6 digital issue or web version) contemplates the year ahead and offers its predictions of the trends that are most likely to dominate the embedded electronics industry in 2022.

Sticking with Embedded, as industry scrambles to achieve previous production levels now two years into an ongoing pandemic, we ask if anything can be done to alleviate the problem (p10 digital issue or web version); we explore one of the most critical decisions designers face when creating new embedded electronic systems: system architecture – and the associated silicon used to implement it (p14 digital issue or web version); and we explain why, in dynamic & evolving sectors such as 5G, data centre & automotive, applications demand ever-increasing compute acceleration, while remaining in tight power envelopes – and how adaptive computing can deliver it (p17 digital issue or web version).

For Mil/Aero, we explain what goes into designing rugged data collection & processing systems that meet the operational & environmental requirements of modern battlefields (p21 digital issue or web version); we explore how high performance signal chain devices, complemented by low noise & high efficiency power management solutions, help make possible today’s mission-critical & rugged advanced aerospace & defence platforms (p24 digital issue or web version); we outline how to maintain operational readiness & secure networks when there is now so much potential for system-to-system RFI/EMI – and how best to dissipate the heat that these electronic systems generate (p27 digital issue or web version); and we discuss the benefits of using mil-spec D38999 connectors and how reverse bayonets gained their reputation as reliable & robust connectors for challenging applications (p29 digital issue or web version).

And finally, for T&M, we include a case study explaining how precision measurement technologies helped deliver challenging state-of-the-art ground & flight testing requirements for a revolutionary aerospace development project at Airbus (p31 digital issue or web version).

As always, I hope you enjoy the issue – and I’d love to hear what you think or any ideas for topics you’d like EPDT to cover in the future. You can email me at mark.gradwell@imlgroup.co.uk...

Mark Gradwell
Editor


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