Bostik further extends Born2Bond range for electronics manufacturing

20 October 2021

Bostik further extends Born2Bond™ range for  electronics manufacturing
Bostik further extends Born2Bond™ range for electronics manufacturing

Adhesive manufacturer, Bostik has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector in the assembling, waterproofing, dustproofing & serviceability of miniaturised electronics such as wearables & handheld devices, as well as larger applications such as smart meters & LED lighting.

Born2Bond™ MECA-based cyanoacrylates and innovative dual-cure Light Lock adhesives (patented in multiple countries) are already available for electronics OEMs for high-precision instant bonding, encapsulation and potting applications. Coupled with automatic dispensing solutions they provide high performing and convenient options for designers and engineers.

The new versatile and single-component High Performance HMPUR (Hotmelt Polyurethane Reactive) range has been designed specifically for the manufacture of miniaturised handheld and wearable electronic devices such as mobile phones, smart watches and headphones. High Performance HMPUR products are available with a range of viscosities and open times to suit different applications and assembly processes.

Ideal for handheld devices and wearable technology, Born2Bond High Performance HMPUR adhesives deliver excellent bonding performance (both rigid and elastic) and are capable of withstanding fluctuations in temperature and humidity, as well as being resistant to impact and chemical or organic compounds such as sweat or sebum.

Born2Bond new UV-CIPG (UV Cure-in-place Gasket) range provides single-component, precise gasketing solutions with typically 0.5-2mm high gaskets for waterproofing, dustproofing and serviceability of mobile phones, tablets, smartwatches, digital cameras and automotive applications, such as battery management systems (BMS), electronic control units (ECU) and advanced driver-assistance systems (ADAS). The adhesives offer excellent adhesion to a variety of substrates including plastic, glass and metal – and provide an effective and cost-efficient solution to cut or moulded gaskets that are typically assembled by hand with significant labour costs and carry a high risk of defect. They also eliminate the need for investment in expensive and space-consuming equipment such as moulds and ovens.

The UV-CIPG range delivers an extremely flexible and robust result that does not crack even when compressed or deformed, and which can withstand exposure to temperature fluctuations and chemicals. With high thixotropic indexes, the products provide a consistent bead aspect ratio and can be rapidly and precisely dispensed using automatic dispensing equipment.

Bostik further extends Born2Bond™ range for  electronics manufacturing_consumer electronics devices
Bostik further extends Born2Bond™ range for electronics manufacturing_consumer electronics devices

For larger applications, such as smart meters and LED lights, where 2-5mm-high gaskets are required for dust and water proofing, Bostik’s UV-FG (UV Foam Gasket) range provides a fast-curing alternative to moulded gaskets that can easily be integrated into manufacturing lines. Its single-component design means mixing is not required and a high-foam expansion enhances resilience during the assembly process.

Polivio Goncalves, Bostik’s Global Head for Engineering Adhesives, says the range delivers the exacting aesthetics and high performance required for miniaturised electronics engineering: “Wearable tech is a growing market and the requirement for ever-more-durable waterproof and dustproof electronics is increasing. These ranges have been designed to support engineers as the market continues to develop.

As part of Arkema Group, Bostik’s offering is extended with High Performance Polymers such as the bio renewable Rilsan® PA11, Pebax® Elastomers, and Kynar® PVDF for battery and electronics designers and manufacturers.

For more information on Bostik’s Born2Bond range for EA in Electronics, please visit:

Bostik further extends Born2Bond™ range for  electronics manufacturing_wearable
Bostik further extends Born2Bond™ range for electronics manufacturing_wearable

For more information on Arkema’s electronics and electrical capabilities, please visit:

About Bostik, Adhesive Solutions by Arkema

Bostik is a leading global adhesives specialist in construction, consumer and industrial markets. It benefits from parent-company, specialty chemicals & advanced materials firm, Arkema’s worldwide infrastructure and full supply chain, including innovative raw materials, sustainable sourcing and energy-efficient production capabilities. Arkema’s high-performance polymers business enhances Bostik’s positioning and offering to its industrial customers. For more than a century, Bostik has been developing leading-edge adhesive solutions that are smarter and more adaptive to the forces that shape daily lives. From cradle to grave, from home to office, Bostik’s smart adhesives can be found everywhere.

About Born2Bond™

Born2Bond™ is Bostik’s range of innovative engineering adhesives, which are designed for by-the-dot bonding and address the exacting demands of contemporary product design and assembly. Suitable for mass production, it provides adhesives for advanced industries such as automotive, electronics, general assembly, luxury goods, medical devices and MRO, where quality of finish, complex design and safety are critical. The product range includes Instant Adhesives, Light Cure Adhesives, Anaerobic Adhesives, High Performance HM-PUR Adhesives, UV-CIPG Gasketing, UV-FG Gasketing, Service Products, with further product ranges in development.

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