EPDT September 2021 issue (inc. Embedded & Energy features + EMS Outsourcing supplement) now available online
02 September 2021
EPDT September 2021 cover image
This month’s issue, now available in print or digital editions, contains features on Embedded technologies and Energy applications, plus the latest edition of EPDT's twice-yearly Electronics Outsourcing supplement.
My Editor's Comment this month considers how, in the run-up to COP26, the pandemic has heightened expectations on what it must deliver – and the role of the STEM community in driving change... (p4 digital issue or web version)
Our sponsored cover story (p6 digital issue or web version) explains how distributor value-added services are now more important than ever.
For Embedded, we feature a viewpoint on the importance of maintaining engineering design principles – even in challenging times (p8 digital issue or web version); and we review new processors designed to address the increasing computing, I/O, memory & security demands for workloads at the embedded edges (p14 digital issue or web version).
For Energy, we outline the role industrial automation software can play in helping drive down carbon emissions to achieve net-zero targets (p18 digital issue or web version); as model-driven development is adopted by the energy industry, we discuss how best to match the performance of the end product to that of the model (p19 digital issue or web version); and we explain how panel connectivity in renewable power plants can play an important role in helping drive adoption of renewable energy (p24 digital issue or web version).
EPDT September 2021 H2 Electronics Outsourcing supplement cover
As the UK edges its way out of the pandemic, our bi-annual Electronics Outsourcing supplement (p25 digital issue) opens with a viewpoint discussing what this return to some semblance of normality means for electronics suppliers, manufacturers & its customers (p26 digital issue or web version). We also feature a case note detailing how production experts worked through the challenges of combining elements of surface-mount & through-hole technologies (p28 digital issue or web version); and we include a tutorial outlining the SMT, pick-and-place & inspection techniques utilised during the electronics assembly process (p29 digital issue or web version). And finally, for T&M, we introduce revised test methods for new standards that manufacturers need to follow in order to reduce electro-chemical failure risks & increase reliability (p32 digital issue or web version).
As always, I hope you enjoy the issue – and I’d love to hear what you think or any ideas for topics you’d like EPDT to cover in the future. You can email me at mark.gradwell@imlgroup.co.uk...
Mark Gradwell
Editor
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