CUI Devices expands heat sinks portfolio with new line of BGA heat sinks
31 August 2021
Electronic components manufacturer, CUI Devices’ Thermal Management Group has announced the continued expansion of its heat sinks product portfolio with the addition of BGA heat sinks.
Compatible with ball grid array (BGA) devices, the HSB family supports a wide range of sizes from 8.5mm x 8.5mm up to 60mm x 60mm with profiles from 6mm up to 25mm. Like its existing line of board level heat sinks, these new BGA heat sink models are conveniently measured under four conditions for thermal resistance, making it easier for designers to select the optimal heat sink for their natural convection or forced air cooled system.
CUI Devices’ BGA heat sinks are made from aluminium with a black anodized finish and feature adhesive mounting styles. Thermal resistances measured at 75°C ?T in natural convection environments range from 6.41 to 39.1°C/W, while power dissipation ratings range from 1.92 up to 11.69 W at 75°C ?T in natural convection.
The HSB models are available immediately with prices starting at $0.42 per unit at 1000 pieces through distribution. Please contact CUI Devices for OEM pricing.
For helpful resources and tools on thermal management, check out our Resource Library that houses a range of blog posts, videos and more.
Product name: BGA Heat Sinks
Availability: Stock to 8 weeks
Possible users: Ball grid array applications
Primary features: Measured under four conditions for thermal resistance, variety of sizes
Cost: $0.42 per unit at 1000 pieces through distribution
View details for the HSB models at: https://www.cuidevices.com/catalog/thermal-management/heat-sinks/bga-heat-sinks
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