EPDT July 2021 issue (inc. ElectroMech & Mil/Aero features + Distribution supplement) now available online
02 July 2021
This month’s issue, now available in print or digital editions, contains features on Electromechanical (including connectors & enclosures) technologies and Military & Aerospace applications, plus the latest edition of EPDT's twice-yearly Electronics Distribution supplement.
Channelling Whitney Houston & George Benson, my Editor's Comment this month reflects on the need for more STEM heroes to help us ‘build back better’ in a post-COVID world... (p4 digital issue or web version)
As embedded computing systems become increasingly critical in demanding military, rail or aerospace applications, our cover story (p10 digital issue or web version) explains what ruggedised PCBs are really made of.
Sticking with Military & Aerospace, we include an optoelectronics case study about the design of an advanced high performance portable laser rangefinder (p20 digital issue or web version).
For Electromechanical, we include a brief layman’s guide to cryogenics & superconductivity – and how to make the right connections (p8 digital issue or web version); now users expect touchscreen-operated devices that are as comfortable and convenient as their mobile phones, we review what this means for electronics enclosures (p14 digital issue or web version); and we explore why circular connectors are an essential component in IIoT systems (p17 digital issue or web version).
We also feature a viewpoint making the case for optimism in UK electronics manufacturing (p6 digital issue or web version).
The latest edition of our bi-annual Electronics Distribution supplement (p23 digital issue) opens with an intro from the ecsn (Electronic Components Supply Network) Chairman, reviewing industry performance against its members’ forecast – and looking ahead to the rest of the year (p24 digital issue or web version). With prices rising, lead times lengthening and many organisations struggling to get hold of the quantities of semiconductors that they need, we include a couple of supply chain viewpoints addressing the ongoing global shortage of chips & electronic components (p27 digital issue or web version & p30 digital issue or web version); and we examine Europe’s standing in the global electronics market (p29 digital issue or web version).
And finally, for T&M, we discuss how practical testing can help give electronics manufacturers confidence when investing in an adhesives process (p32 digital issue or web version).
As always, I hope you enjoy the issue – and I’d love to hear what you think or any ideas for topics you’d like EPDT to cover. You can email me at firstname.lastname@example.org...
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