EPDT's H1 2021 IoT & Industry 4.0 supplement now available online

Author : Mark Gradwell | Editor | EPDT

02 June 2021

EPDT June 2021 1H IoT & Industry 4.0 supplement cover image

Included in this month’s EPDT June 2021 issue, the latest edition of this year's bi-annual IoT & Industry 4.0 supplement is now available in print or digital editions.

Included in EPDT's June 2021 issue, EPDT's latest IoT & Industry 4.0 supplement (p21 digital issue) opens with a review of some of the themes from industrial IoT specialist, Advantech’s Online Partner Conference, including how COVID is impacting adoption of IIoT technologies (p22 digital issue or web version).

It also explores IoT cybersecurity challenges and how to deploy IIoT devices to cloud applications securely and at scale (p24 digital issue or web version); it outlines a new methodology for remotely debugging fleets of deployed IoT devices (p26 digital issue or web version); and it asks if the next generation of sensor-to-satellite solutions could provide the key to delivering truly affordable, universal IoT access (p28 digital issue or web version).

EPDT's June 2021 issue also contains features covering RF & Wireless and Industrial technologies and applications, as well as editorial considering how, as we ease our way out of lockdown 3.0, we are tentatively braced for further relaxations of coronavirus restrictions – and what it might mean for the business community and electronics industry (p4 digital issue or web version), plus a cover story introducing a major new event for our industry, Manufacturing & Engineering Week, with particular focus on its Design Engineering Expo (p6 digital issue or web version).

EPDT June 2021 cover image

I hope you enjoy our biannual look at the world of IoT & Industry 4.0 – and I’d love to hear what you think or any ideas for topics you’d like EPDT to cover in future editions. You can email me at: mark.gradwell@imlgroup.co.uk...

Mark Gradwell

Editor


More information...

Contact Details and Archive...

Print this page | E-mail this page