EPDT May 2021 issue (inc. Lighting & Rail features + PXI for T&M supplement) now available online

Author : Mark Gradwell | Editor | EPDT

02 May 2021

EPDT May 2021 cover image

This month’s issue, now available in print or digital editions, contains features on Lighting technologies & Rail applications, plus editorial discussing the impact of ongoing semiconductor chip shortages and EPDT's annual PXI for Test & Measurement supplement.

My Editor's Comment this month discusses the impact of ongoing semiconductor chip shortages, precipitated by the COVID-19 coronavirus pandemic, on the electronics industry... (p4 digital issue or web version).

Our cover story (p16 digital issue or web version) explores the technological changes in onboard rail computing that will allow customers to better connect to the internet and stream high-quality content.

Sticking with Rail, we also explain what components are needed to maximise electrical safety and performance in rail, smoothing the transition to greener rail (p14 digital issue or web version); and we feature a case study on the embedded computing platform for Network Rail’s CCTV level crossing surveillance system (p19 digital issue or web version).

For Lighting, we examine how design engineers are utilising ultraviolet & infrared LEDs in the fight against COVID-19 (p6 digital issue or web version); we review how design engineers can minimise EMI when using LED drivers (p7 digital issue or web version); and we discuss how UV-C LED-based disinfection technologies can be brought to market safely (p12 digital issue or web version).

EPDT May 2021 PXI for T&M supplement cover

Our annual PXI for T&M supplement (p21 digital issue) opens with the PXISA President outlining what the PXI standard is and why it matters for test (p23 digital issue or web version). We also explain how flexible, modular test systems can automate fault insertion to improve automotive software quality (p24 digital issue or web version); we review why, to keep up with the demands of modern device test, a modular, integrated, software-defined test set-up is essential (p27 digital issue or web version); we discuss how dynamic digital instrumentation with PMU functionality allows test engineers to verify the structural integrity of the DUT (p29 digital issue or web version); and we include a case study on using software-defined modular PXI instrumentation to build a highly parallel measurement system for in-fab semiconductor wafer test, helping streamline the R&D process flow (p31 digital issue or web version).

As always, I hope you enjoy the issue – and I’d love to hear what you think or any ideas for topics you’d like EPDT to cover. You can email me at mark.gradwell@imlgroup.co.uk...

Mark Gradwell

Editor


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