Party time for really outside-the-box thinking: Sondrel designs its first rad-hard chip

18 March 2021

Sondrel_Rad-Hard_chip-design

IC design & delivery consultancy, Sondrel is designing its first radiation-hardened (rad-hard) chip for a customer, which is due to tape out shortly. The satellite modem will be used in communication satellites & therefore has to be able to withstand the challenges of the high levels of ionising radiation found in orbit, which can cause glitches.

Graham Curren, Sondrel CEO said: “The customer came to us because quality and reliability are paramount for a chip that goes into space. It has to work correctly all the time, as you can’t get an engineer to swap it over if a problem occurs. Our work on functional safety for chips that are used in mission critical applications in cars and planes means we understand how to design for all eventualities. It takes really outside-the-box thinking to imagine what could possibly go wrong and design solutions should that occur. The engineers really enjoy the brainstorming sessions to come up with unusual scenarios – and solving them – as it stretches their imaginations in a very rewarding way. In pre-COVID days, those session were like a party game, with everyone chipping in ideas over pizzas.”  

Kirthi Kishore, Level 3 Staff Engineer at Sondrel office in Hyderabad, India added: “Neither the process, nor the cells and IP are specially designed to be radiation hardened. The key is to build in redundant logic in case of damage, or to take over while an affected part is rebooted. In the case of the ARM 853 processor at the heart of the chip, the design has to ensure that the processor reboots correctly if a hard reset is needed due to a radiation event.

Eshwar Rao Thelaga Thothi, Physical Design Engineering Manager at Hyderabad explained: “Incorporating these rad-hard requirements into chip-implementation and signoff flows is quite interesting, as we get to see the impact of rad-hard cells in cell placement, and also its effect on overall chip performance.

The design is for the 22nm GlobalFoundries process, which is less susceptible to radiation than smaller nodes. It has an area of 200 mm2 with 15 IP blocks with over 46 million instances. 


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