Filling a gap in the market

21 July 2008

A thermal interface pad for high-end gap filling in the computer and telecoms markets has been launched by Chomerics Division Europe.

THERM-A-GAP 976 is electrically non-conductive and has a thermal conductivity of 6W/mk. The unsupported boron nitride-filled silicone elastomer is available in sheets or custom die-cut parts between 1mm to 5mm in thickness.

According to the company, the soft nature of the material, which has a Shore A hardness of 10, allows it to conform to mating component surface irregularities under low compression forces; which helps to minimise the stress on components.

The product is the latest addition to a range that includes THERM-A-GAP 974 (with a thermal conductivity of 5W/m-k and available in thicknesses of 0.5mm to 1.50mm) and THERM-A-GAP G974 (with an added fibreglass carrier to improve mechanical resistance and has a thermal conductivity of 4W/m-k). All have an operating temperature range of -65ºC to +150ºC and are RoHS compliant.


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