LOPEC & OE-A at electronica 2018: printed electronics offer the perfect complement to semiconductors
30 October 2018
During the afternoon of two exhibition days, the PCB Marketplace Forum at electronica will be dedicated to printed electronics
At electronica, LOPEC & OE-A present the current state of printed electronics via a series of seminars with international experts at the PCB-Marketplace Forum (Hall A1.263). Key topics include automotive applications & the future of electronics.
In November, the world of electronics comes together in Munich at electronica, the world's leading exhibition & conference for electronics. LOPEC, the International Exhibition & Conference for the Printed Electronics Industry, will also be represented at the event to present the current state of the technology together with the OE-A (Organic and Printed Electronics Association).
During the afternoon of two exhibition days, the PCB Marketplace Forum will be dedicated to printed electronics. A comprehensive overview of the entire value chain in this industry will be presented by LOPEC in Munich — the next edition taking place from March 19 to 21, 2019.
The importance of printed electronics is on the rise. It is a driver of innovation in many areas, such as the automotive and packaging industries, consumer electronics, smart textiles, or the pharmaceutical and medical industry. At electronica, taking place from November 13 to 16, this topic will receive a great deal of focus.
The OE-A, a working group within the VDMA (Germany's Mechanical Engineering Industry Association: Verband Deutscher Maschinen- und Anlagenbau), will be represented with its own stand (A1.152). There, the association will present tangible products and prototypes of the key technology to illustrate possible applications. At the stand, interested visitors can also get more information about LOPEC and learn about the broad spectrum of the exhibition and conference.
Printed electronics is ready for the mass market
How can printed and conventional electronics be combined to achieve the best results in functionality and application? These questions and more will be addressed in a series of presentations at the PCB Marketplace Forum. Under the central theme “Thin—Lightweight—Flexible: Organic & Printed Electronics for the Individualised Mass Market”, top-class experts from industry and research will provide insights into the current state of technology and demonstrate the possibilities of printed electronics.
On Wednesday, November 14, the presentations will focus on the topic of ‘Automotive Applications’. Ulrich Frei, Head of Exterior Application Engineering at OSRAM Opto Semiconductors GmbH, will present LEDs and OLEDs in future mobility concepts. Flexible touch sensors offer new and innovative HMI solutions for vehicle interiors: this is the topic Wolfgang Clemens, Head of Product Management at PolyIC GmbH & Co. KG, will talk about in his presentation. The Fraunhofer Institute for Organic Electronics, Electron Beam & Plasma Technology FEP will address, among other things, flexible OLED light sources. In his presentation, André Philipp will point to opportunities, challenges and solutions with regard to this topic.
On Thursday, November 15th, the topic will be ‘Production of Future Electronics’. Dr. Ashok Sridhar, Senior Business Developer at the Holst Centre, will be among those providing an outlook. Smart surfaces are becoming increasingly important. Sridhar will show how printed electronics can have a positive influence on this development. Jukka Hast, Adjunct Professor at the VTT Technical Research Centre of Finland, will present his results on the roll-to-roll manufacturing of smart structures.
The series of seminars, which take place on both days from 2:30pm to 5:40pm and 5:20pm respectively, is organised by the OE-A.
Interested visitors to LOPEC will get a comprehensive overview of the entire value chain of the printed electronics industry — from research & development to actual application. The leading exhibition and most important conference for the printed electronics industry takes place annually at the ICM, International Congress Center Munich.
LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading international event for printed electronics. The combination of an exhibition and a conference is the perfect way to depict the complex and dynamic nature of this young industry. Around 2,500 participants from 51 countries attended the event in 2018. There were 153 exhibitors from 21 countries, and 188 conference presentations from 25 countries. LOPEC is organised jointly by the OE-A (Organic and Printed Electronics Association) and Messe München GmbH. The next event takes place from March 19 to 21, 2019 at the ICM – Internationales Congress Center München in Munich, Germany.
Messe München is one of the leading exhibition organisers worldwide with more than 50 of its own trade shows for capital goods, consumer goods and new technologies. Every year, a total of over 50,000 exhibitors and around three million visitors take part in more than 200 events at the exhibition center in Munich, at the ICM – Internationales Congress Center München and the MOC Veranstaltungscenter München as well as abroad. Together with its subsidiary companies, Messe München organizes trade shows in China, India, Brazil, Russia, Turkey, South Africa, Nigeria, Vietnam and Iran. With a network of associated companies in Europe, Asia, Africa and South America as well as around 70 representations abroad for over 100 countries, Messe München has a global presence.
The OE-A (Organic and Printed Electronics Association) was founded in December 2004 and is the leading international industry association for organic and printed electronics. The OE-A represents the entire value chain of this industry. The members are world-class global companies and institutions, ranging from R&D institutes, mechanical engineering companies and material suppliers to producers and end-users. Well over 200 companies from Europe, Asia, North America, South America, Africa and Oceania are working together to promote the establishment of a competitive production infrastructure for organic and printed electronics. The OE-A is building a bridge between science, technology and application. The OE-A is a working group within VDMA.
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