NEXT WEEK’S BIG EVENT - SMT/Hybrid/Packaging 2008
26 May 2008
SMT
The trade fair and conference for system integration in micro electronics, takes place at the Nuremberg Conference Centre from 3-5 June.
Organised by Mesago Messe Frankfurt and led by Professor Herbert Reichl of Fraunhofer Institute for Reliability and Micro-integration, Berlin, SMT/Hybrid/Packaging 2008 will consider requirements on electronic assemblies for automotive manufacturing. Last year’s event attracted 591 exhibitors and 24,471 visitors, and it is hoped that there will be more this year.
The expected visitors will include an international qualified audience comprising of representatives from the chemical industry and automobile industry. Additionally, electrical engineers, electrical manufacturers, and SMT assemblers will be present, along with representatives of semiconductor production, micro electronics, SMT-soldering, opto electronics, precision engeneering, micro system technologies, computers and networks, factory automation, CAD in electronics, quality assurance, and automation control will attend.
The exhibitors that have already booked their space confirm that a full range of products will be on show, from PCBs, soldering equipment, screen-printing and hybrids, to placement technologies and numerous other advances in the electronics branch.
Exhibitors will represent modern production, electronic systems, design and development, components, PCB, test systems, packaging and basis materials, machinery, apparatus, automobile engineering, information and communication technology, advanced packaging, ASICs, automatic placement machines, BGAs, board design, CAE, FPGAs, hybrids, soldering, MCM, PCBs, test, screen printing, SMD/SMT, test equipment, and materials.
Speakers at the conference include Dr. Ning-Cheng Lee, Jean-Paul Clech, and Dr. Jenny S. Hwang.
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has more than 22 years of experience in the development of fluxes and solder pastes for SMT industries as well as experience in the development of underfills and adhesives. He received his PhD in polymer science from the University of Akron in 1981 and a BS in chemistry from National Taiwan University in 1973. Lee is the author of Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies, and co-author of Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by McGraw-Hill. Lee is honoured as SMTA Member of Distinction 2002, received the Lead-Free Co-Operation Award from Soldertec in 2003, and the Exceptional Technical Achievement Award from CPMT in 2006. He serves on the board of director for SMTA, and has also served on the board of governors for CPMT of IEEE.
Jean-Paul Clech has over 20 years of experience in SMT design, soldering quality and reliability assurance. His current research interests are in BGA, CSP, flip-chip and lead-free assembly reliability, including the development of lead-free solder acceleration factors and life prediction models. Clech is the principal developer of the Solder Reliability Solutions model and application software and has served as an expert-witness in product litigations involving solder joint field failures. He received the Diplôme d' Ingénieur from Ecole Centrale de Paris, France (Materials Science major), and MS and Ph.D. degrees in Mechanical Engineering from Northwestern University, Evanston, Illinois. As the author of over forty technical papers, Clech is a frequent speaker at technical conferences, and has been an invited lecturer and instructor at various corporate events and professional venues in Asia, Europe and North America. He is an active member of ASME, IEEE, IMAPS, TMS and SMTA and in 2003, Jean-Paul Clech received the SMTA Member of Distinction award. Furthermore, he received the IPC Distinguished Committee Service Award in 2006.
Dr. Jenny S. Hwang will bring her 28-year SMT manufacturing experience combined with her 18-year sustained lead-free research and development and production implementation to her tutorial. She has been a major contributor to the Surface Mount Technology since its inception, having provided hands-on solutions to production and reliability issues. She is also an advisor to major OEMs, EMSs and government including the US DoD F-22 project. Among her various awards and honours are citations by the US Congressional recognition, and induction into the National Academy of Engineering. She has also been a recipient of the YWCA Women Achievement Award and inducted into the WIT International Hall of Fame. Hwang holds a number of patents, has authored 300 publications and several textbooks, and taught over 25,000 professionals in development courses.
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