ElectroTestExpo returns for its eighth year…

Author : James Stanbridge, UK & Ireland Regional Manager at JTAG Technologies

07 February 2018

ElectroTestExpo 2018

Back in 2010, a group of leading test equipment vendors, disillusioned by the lack of a forum to present the latest technological advances in electronics testing, established ElectroTestExpo – a co-operative event aimed at hardware design and production test engineers interested in the latest tool developments. This piece previews this year’s upcoming event...

For the digital issue of this piece, please visit this link – or click here to register for EPDT's magazine.

Originally hosted at Bletchley Park, home of British codebreaking during WWII and a birthplace of modern information technology, the event has since toured the country. This year’s event takes place on 14th March at Towcester Racecourse, in the stunning Northamptonshire countryside – one of the most picturesque venues in the country, close to Silverstone, Caswell Park and a cluster of high technology companies. Now in its 8th year, ElectroTestExpo highlights the importance of testing, offering a free exchange of information among professional engineers involved in the design and manufacture of printed circuit boards.

The event combines an exhibition featuring test equipment specialists such as Cobham/Aeroflex, JTAG Technologies, Pickering Interfaces, TTi, Elite Interfaces and more – alongside a seminar programme focusing on the latest in test technologies. It is aimed at electronics engineers interested in ‘board bring-up’, hardware validation or production testing.

On show will be a wide selection of test and measurement instrumentation, from oscilloscopes, RF generators, logic analysers and other benchtop tools, to integrated production test systems based on advanced technologies that include AOI systems, flying-probe testers, mass interconnect systems, DFT analysis software, PXI systems, and JTAG/boundary-scan testers and programmers.

An informative free seminar programme will cover many aspects of test throughout the product lifecycle, offering value for engineers seeking technical information on the latest test and inspection techniques. Choose from talks on JTAG/boundary-scan, ATE building, signal switching and high-integrity mass interconnection systems. In addition to seminars, experts in most aspect of electronics test will be on hand – only too willing to share their knowledge. 

Seminar topics include:

ATE Switching: What are your Options? 
(Pickering Interfaces
) – The majority of ATE requires switching to increase flexibility when connecting instrumentation to the device under test (DUT). DUTs have a huge range of voltage, current and frequency specifications.

Gain an overview of different switch types and configuration s to optimise test system cost and size. A range of architectures will be discussed, with special emphasis on PXI. Low Cost JTAG Tools for Hardware Validation (JTAG Technologies) – Traditional JTAG/boundary-scan tools used in production testing use sophisticated automatic program generators that can be costly. Low-cost, yet still powerful, tools now exist to serve the design community and those with small-scale production needs. See how JTAG can help you with your next board ‘bring-up’.

Low Cost JTAG Tools for Hardware Validation
(JTAG Technologies) –
Traditional JTAG/boundary-scan tools used in production testing use sophisticated automatic program generators that can be costly. Low-cost, yet still powerful, tools now exist to serve the design community and those with small-scale production needs. See how JTAG can help you with your next board ‘bring-up’.

Eliminating Cables from Modular ATE Platforms
(MAC Panel) –
Modern test systems are typically built using high performance PXI modular instrumentation. PXI offers outstanding performance combined with very high density I/O. Choosing the best electrical interconnection to the system is critical to maximising its performance potential. Explore different connections options available for PXI-based test systems to maximise performance, value and scalability.

Other topics include RF Test Integration in ATE (Cobham/Aeroflex); Maximum Test Coverage with Minimal Costs (Aster Technologies); and Making Vector Network Analysis Accessible (PicoScope).

ElectroTestExpo is funded by a co-operative of T&M equipment vendors, making it free to attend for end users and customers and open to all engineering professionals.

Visit www.electrotestexpo.co.uk for more information.


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