Nokia and ST join forces in 3G development

01 September 2007

Nokia and STMicroelectronics, already collaborate on licensing and supply of IC designs for 3G, but have taken this agreement further with a part of the Finnish telecomms company’s IC operations to the European
semiconductor company.

The two companies have a history together in 3G. ST’s design was chosen for the Nokia 3G HSPA (high-speed packet access) chipset, its first design win of a complete 3G chipset. ST will design and manufacture 3G chipsets, based on Nokia’s modem technologies, energy management and RF technology for both Nokia and the open market. In all, around 200 Nokia employees in Finland and the UK
will move to ST’s premises in Q4, this year.

Nokia will develop its modem technology, including protocol software and digital design for WCDM/GSM which it will license to manufacturers to develop and produce chipsets for Nokia and those made available on the open market.

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