45nm by September
01 May 2007
From the Hsinchu district of Taiwan, foundry TSMC (www.tsmc.com) announces that 45nm qualification will be completed and production will begin this September. The process delivers a higher speed, lower power and twice the density of 65nm process devices.
The foundry’s 45nm process uses 193nm immersion photolithography with silicon strains and low-k inter-metal dielectric material to double the density of the 65nm process while lowering power and the manufactured cost per die.
Obvious markets will be system on chips for mobile phones, portable media players, PDAs and handheld devices. The foundry expects devices using this process will have 40 per cent more functionality or 40 per cent less die size, all with less power consumption.
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