Freescale joins IBM R&D

01 July 2007

Freescale (www.freescale.com) has joined the IBM technology alliance (www.ibm.com/chips) for semiconductor research and development.

It is the first technology partner to be a part of both low power and high-performance technology R&D. The agreement covers CMOS (Complementary Metal Oxide Semiconductor) and SOI (Silicon On Insulator) technologies, as well as R&D for the transition at the 45nm generation of devices. As a result of the agreement, Freescale will add access to IBM’s Common Platform partners’ manufacturing capability, to the capacity in internal fabs and from foundry manufacturers. The Common Platform provides partners with synchronised manufacturing processes for flexible, multisource, high volume manufacturing.

The embedded semiconductor company has also joined forces with Motorola (www.motorola.com) as a preferred supplier of 2G and 3G chipset platforms. (Freescale used to be known as Motorola Semiconductor.) The mobile phone company already uses Freescale chipsets in its popular RAZR, PEBL, SLVR and KRZR K1 handset designs.

Sandeep Chennakeshu, general manager Freescale’s Wireless and Mobile System Group, explains ‘Our high-speed, low-power CMOS technology, RFCMOS transceivers and power management ICs are designed to provide Motorola the performance and functionality needed for next-generation mobile multimedia devices.’

Freescale plans to deliver baseband, power management, RF transceivers and power amplifier technologies across several Motorola handset designs. In return, Motorola will receive advanced chipsets for use in its next-generation EDGE, 3G and multimedia handsets.


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