Electronic Product Design & Test - Products

Products - Embedded

New Digi-Key IoT Studio delivers simplicity to IoT developers

First congatec SMARC 2.0 module with NXP i.MX8 processor

UK distributor for DFRobot Education Products and Accessories for STEM and micro:bit announced

Paper-to-digital conversion software milestone: Industry 4.0 experts partner up

The EU’s TULIPP project enhances embedded vision applications

Interactive digital tiles turn bedroom walls into cinema screens

- Breakthrough true wireless earphones with cutting-edge Bluetooth SoC (29/10/2018)
  
  Samurai Ears Japan, an audio-visual brand, have announced their audiophile-grade true wireless earphones, STW-D01a – which features the latest Bluetooth Audio SoC, Qualcomm QCC3026, based on an ultra-low-power architecture.
- MEN Mikro Elektronik set to bring new IT security solutions in the railway market (19/10/2018)
  
  MEN Mikro Elektronik has recently been made part of the German research consortium 'Hardware-based Security Platform for Railway Control and Security Technology' – bringing their expertise to railway control and security technology implementation.
- Get Kids Coding! Farnell Element14 begin shipping 65,000 micro:bit boards to Danish schools (11/10/2018)
  
  Element14.com, the online community for engineers, has launched a new competition that tasks members with building and blogging a Halloween-themed electronic project – for the chance to win a powerful 3D printer.
- Congatec release latest AI-focused, entry-level platform for high-end embedded computing (09/10/2018)
  
  Congatec introduce a cost-efficient computer-on-module for the entry-level of high-end embedded computing – whose fast 16 PCIe Gen 3.0 lanes make it ideal for all new AI and machine learning applications, which require multiple GPUs for massive parallel processing.
- Octavo introduce a complete 1GHz computer in a 27mm package (08/10/2018)
  
  The SiP technology leaders have announced the most completely integrated 1GHz Arm Cortex-A8 computing platform, the OSD335x C-SiP (complete system-in-package), which integrates the required components for a computing system into a single, Lego-brick-sized IC package.
- Robotics company SLAMcore raises $5M to bring spatial AI algorithms to market (28/09/2018)
  
  SLAMcore, a UK company developing spatial AI algorithms for robots and drones, have announced that it has raised $5m in funding – led by global technology investor Amadeus Capital Partners.
- 80-ft far field wireless – even pad-less! – device charging (26/09/2018)
  
  Introducing the Bluetooth-approved PowerSpot embedded transmitter: industry’s first device to communicate in the far field to charge multiple consumer gadgets over the air – and all with no charging pads.
- Isolated 4-port power over Ethernet PSE controller passes IEEE 802.3bt conformance tests (24/09/2018)
  
  Analog Devices announces the Power by Linear™ LTC4291/92 isolated 4-port power source equipment (PSE) controller chipset, the first of its kind to pass a series of IEEE 802.3bt (PoE++) power over Ethernet (PoE) conformance tests administered by Sifos Technologies.
- Best-in-class power consumption for Bluetooth-certified system-on-chip (SoC) (17/09/2018)
  
  ON Semiconductor have extended its RSL10 family of Bluetooth 5-certified radio SoCs: supporting Bluetooth low energy wireless profiles, RSL10 devices can easily be designed into any connected application, including medical wearables, smart locks and appliances.

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