METCASE has launched its new TECHNOMET range, a step forward in the design of standard desktop and portable instrument enclosures.
CP Electronics responds to market demand with improved green-i energy controls for the electrical wholesaler market.
The Technical University of Munich and Ludwig Maximillians University of Munich can now produce extremely thin and robust, yet highly porous semiconductor layers.
TEKO launches a new range of larger enclosures for Raspberry Pi 2 and model B+ computers, coinciding with the fifth million Raspberry Pi rolling off the production line at the Sony UK Technology Centre in Bridgend, Wales.
Intersil introduces new radiation hardened multiplexers that offer electrostatic discharge (ESD) protection, and high signal chain accuracy and timing performance.
TE Connectivity announces its COPALUM Lite sealed terminals and splices that provide up to 60 per cent in weight savings versus copper terminal alternatives.
Dengrove Electronic has a selection of products for EMI management, including fabric-over-foam gaskets in over 70 different standard profiles and sizes.
ARBOR Technology announces the IEC-3300, a small boxed chassis system based on the new Intel Celeron SoC & Atom processors E3800 family.
Walther Trowal presents its new washing machine, TRT 83x37, which removes thick layers of lubricants from the surface of disassembled equipment components.